**Abstract:**
An automatic single or dual wave soldering machine has been developed, utilizing a three-phase asynchronous induction pump as the crest generator. This innovative design replaces traditional mechanical pumps, eliminating rotating parts, wear, and maintenance requirements. As a result, the system significantly enhances the reliability and efficiency of the entire soldering process.
**Keywords:** three-phase asynchronous induction pump, wave soldering machine, maintenance-free, no moving parts
**1. Current Situation at Home and Abroad**
The dual-wave surface mount technology (SMT) involves the use of both single and dual wave soldering processes for printed circuit boards. Traditional wave soldering machines rely on mechanical pumps to generate the solder wave. In China, early systems used mechanical pump technology, while later developments included a single-phase induction electromagnetic pump. However, these systems still had limitations in stability and performance.
In foreign countries, similar mechanical pump-based systems were widely used. By the late 1980s, Switzerland and the U.S. introduced conductive electromagnetic pump wave soldering machines, but due to instability, they were eventually discontinued. In the 1990s, China made significant progress by developing its first generation of single-phase induction electromagnetic pump wave soldering machines. Subsequently, the second generation, based on three-phase asynchronous induction pumps, was successfully developed, leading to mass production of single/dual wave automatic soldering machines.
**2. Necessity of Developing Three-Phase Induction Pump**
Traditional mechanical pump wave soldering machines suffer from several drawbacks. The rotating blades operate at high temperatures (around 250°C), leading to rapid wear, frequent maintenance, and contamination from solder residue. Additionally, the movement of the blades causes turbulence on the tin surface, increasing oxidation and slag formation, which raises production costs.
To address these issues, conductive electromagnetic pumps were introduced, removing the need for rotating parts and reducing maintenance. However, their unstable structure caused fluctuations in the solder wave, making them unsuitable for precise applications. Later, single-phase induction electromagnetic pumps improved stability, but struggled with wide and high peaks.
In response, China developed the three-phase asynchronous induction pump, which eliminates rotating parts, reduces wear, and provides a smooth, stable solder wave. It can produce wide peaks (up to 400mm) and high peaks (up to 40mm), meeting modern industrial demands.
**3. Technical Principles**
**a. Mechanical Pump Soldering Machine**
Mechanical pumps use rotating components to push molten solder, causing wave instability. Additional pressure is often required to stabilize the flow, and the high temperature leads to blade wear and increased oxidation, resulting in more slag and higher maintenance costs.
**b. Conductive Electromagnetic Pump**
This system uses magnetic fields to push liquid metal without moving parts. However, the direct contact between electrodes and molten solder can lead to oxide buildup, causing wave instability and reduced performance. Many imported models have been abandoned due to these issues.
**c. Inductive Electromagnetic Pump**
Based on phase differences in magnetic fields, this system generates a forward force to move the solder. However, it struggles with producing large and stable waves, limiting its application in high-demand scenarios.
**d. Three-Phase Asynchronous Induction Pump**
This patented technology uses three-phase power with a 120° phase difference to create a stable forward magnetic field. It produces a linear thrust, eliminating rotation and reducing oxidation. It offers high efficiency, smooth wave crests, and the ability to generate wide and high peaks. It also reduces maintenance and improves welding reliability.
**4. Application and Comparison**
Using the three-phase asynchronous induction pump in single/dual wave soldering machines has shown significant improvements. The perturbation vibration wave superposition effectively removes gas from flux and adhesive, improving solder joint quality. The smooth wave crest and minimal surface disturbance reduce oxidation and slag, saving material and labor costs.
The system is highly efficient, with low thermal and current loads, ensuring long-term reliability. It operates without rotating parts, eliminating the need for regular maintenance. Overall, it addresses most of the challenges faced by traditional systems, offering a reliable, cost-effective solution for advanced electronics manufacturing.
**5. Conclusion**
The three-phase asynchronous induction pump-based wave soldering machine represents a major advancement in the industry. It solves many of the limitations of older technologies, including maintenance needs, oxidation, and wave instability. With its high efficiency, durability, and adaptability, it is set to become the standard in future electronic packaging and SMT applications. Its potential for global and domestic adoption is strong, promising a more efficient and sustainable approach to wave soldering.
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Huade Heavy Industry Technology Co., Ltd , https://www.huadebaler.com